Process Modules for High-Density Interconnects in Panel-Level Packaging
نویسندگان
چکیده
منابع مشابه
Advanced Broadband 2nd-Level-Interconnects for LTCC Multi-Chip-Modules
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ژورنال
عنوان ژورنال: IEEE Transactions on Components, Packaging and Manufacturing Technology
سال: 2020
ISSN: 2156-3950,2156-3985
DOI: 10.1109/tcpmt.2019.2956325